2022 Earthquake Engineering Young Scholar Exchange Conference Successfully Held
In order to communicate on theoretical, research and practical achievements in earthquake engineering in recent years, to promote the development of comprehensive disaster reduction technology in seismically active areas, and to enhance academic exchanges among young scholars in earthquake engineering field, 2022 Earthquake Engineering Young Scholars Exchange Conference was successfully held. The conference was hosted online by Sichuan Cataclysmic Mechanics and Engineering Disaster Prevention Key Laboratory together with Sichuan University Western China Earthquake Disaster Prevention Research Center, and co-hosted by Sichuan University, Southeast University, Central South University, Tongji University, Institute of Engineering Mechanics of China Earthquake Administration, and South China University of Technology.
The conference was launched by Professor Lu Zheng from Tongji University, Professor Guo Wei from Central South University, Researcher Qu Zhe from the Institute of Engineering Mechanics of China Earthquake Administration, Professor Zhao Junxian from South China University of Technology, Professor Wang Chunlin from Southeast University, and Professor Wang Bin from College of Architecture and Environment of Sichuan University. Wang Bin presided over the opening ceremony of the conference. Professor Dai Kaoshan, Director of Department of Civil Engineering of Sichuan University, delivered a speech at the opening ceremony.
The conference invited 26 young Chinese scholars to give academic reports, attracting more than 700 online participants. In-depth and extensive academic discussions and exchanges have been conducted on themes including strong earthquake observation and earthquake disaster simulation, infrastructure disaster prevention capability improvement, earthquake recoverable functional structure system, high-performance seismic mitigation and isolation devices, and non-structural components and industrial seismic structures.
